Fast Turn Delivery Of Pick and Place and Die Sort Service What We Do After dicing your wafer, we can pick the cut die pieces from the dicing tape, inspect them, and place them in the appropriate container. How We Do It Our automatic Pick and Place process uses pattern recognition to identify, locate, and align on the appropriate die and recognize ink dot test margins. It will then pick that die and place it in the appropriate container. For large or irregular shaped die pieces we use our manual picking process. Using microscopes, vacuum wands, and tweezers we manually pick your die pieces from the cut wafers and place them in waffle or gel paks. After inspection, containers are sealed and labels are added. What We Do For You  Utilize a fully automatic or manual pick and place procedure  Inspect to Mil Standard 883 method 2010  Offer a quote within 24 hours  Label your packages according to your specifications, barcode, or text  Offer services for small and medium quantities  Provide quick-turn service Shipped To You On  Gel Paks  Waffle Paks Depending on the size of the order, we can usually ship in 3 to 7 working days. We accept purchase orders and most personal and corporate credit cards. © 2002 - American Precision Dicing, Inc.